DENSO CORPORATION The 40th Tokyo Motor Show 2007
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Driving force behind new value creation

DENSO manufactures many products for an advanced automotive society. Our communications, display and semiconductor technologies all add value to our products.

  
   
 

MEMS (Micro Electro Mechanical Systems)

Improved environmental and safety performance with semiconductor sensors manufactured using leading technology

MEMS are microstructures manufactured on semiconductor wafers using semiconductor process technologies. In recent years, the MEMS technology has been widely applied to various devices for sensors, ink-jet printer heads, and other products.

Protective layer is formed partly on the surface of a semiconductor wafer, then the unprotected potion is etched deeply to form three-dimensional micromechanical components.
DENSO has developed a technology for deeper and narrower trench not possible before, thus expanding the range of MEMS applications. DENSO is using this technology to mass-produce components for G sensors that activate air bags upon detecting a collision. In addition, based on this technology, DENSO has been developing optical components, such as prisms for laser sensors and other products.

DENSO has continuously improved its semiconductor technologies since the early 1970's. With this history, DENSO's semiconductor technologies offer the world's deepest etching for MEMS applications.

  
     
 
 
   
 

SiC power devices

New semiconductor to lead the next generation of motor control

Hybrid vehicles and electric vehicles are important options for CO2 emissions reduction and energy problems solution.
To control the traction motors of these vehicles, inverters are essential components.

Silicon carbide (SiC) is a promising material for power devices for inverters, etc. Compared to current power devices made of silicon (Si), SiC power devices will pave the way for smaller yet more powerful inverters, since SiC withstands higher voltage and higher temperature, and suffers less power loss than Si.
One of the biggest hurdles in commercializing SiC power devices is the need to create SiC wafers with the high crystallinity required in on-vehicle power devices. DENSO has been working to produce higher crystalline SiC wafers, and succeeded in producing SiC wafers with the smallest level of defect density in the world ﾐ some hundreds per one square centimeter.